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Rhodium Plating
Gold Plating
Electroless Gold Plating
Silver Plating
Bright Nickel Plating
Electroless Nickel       Plating
Tin Plating
Lead Plating
Cadmium Plating
Zinc Plating
Conversion Coating
T.C.P. Process
Phosphating Manganese
Phosphating Zinc

An ISO 9001-2008 Company

   ISO 14001-2004



Tin Plating(MIL-T-10727B):


Color is gray white in plated condition, had very high luster in fused condition. Soft, but is very ductile. Corrosion resistance is good. (Coated items should meet 24 hour 5% salt spray requirement.) Solder ability is excellent. Tin is not good for low temperature applications (changes structure and loses adhesion when exposed to temperatures below -40 degrees C). If a bright finish is desired to be used in lieu of fused tin, specify Bright Tin plate. Thickness can exceed that of fused tin and in deposit shows excellent corrosion resistance and solder ability.

Type I:      Electrodeposited
Type II:    Hot dipped

Tin Plating

.0001 – .00025”: Flash for solderin
.0002 – .0004”: to prevent galling and seizing .0003” min: Where corrosion resistance is important
.0002 – .0006”: To prevent formation of case during nit-riding.


Immersion Tin

Stannatech - The Industry benchmark for Immersion Tin for multiple Pb-free soldering and press-fit technology

Within the electronics industry immersion tin is recognized as a reliable surface finish for both PWBs and IC substrate applications. It is used in many market segments, such as automotive, communications, consumers and industrial electronics.
With more than 160 Installations, Stannatech is the mostly used immersion tin process worldwide. Stannatech can be run in vertical and horizontal mode. High bath stability combined with consistent plating quality due to the support of peripheral equipment like Crystallizer and Constannic.
Whisker growth is reduced well below IPC's specification with the 'Anti-Whisker Additive' (AWA) and meets demands of the automotive industry. Surface contamination, which is critical for immersion tin baths can be dramatically minimized by using a special process step, Ionix SF. Yellowing of the tin surface due to the harsh  conditions during Pb-free soldering in an air environment is avoided with PostDip 270. Ionix SF is a standard process step for Stannatech horizontal and vertical, whereas PostDip 270 is offered optionally to Stannatech Horizon.


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